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Truffle-1 hardware thread

A seven-post X thread on Truffle-1 hardware, from SLA resin shells and thermal failures to FDM iteration and the SLS-printed ceramic-esque finish.

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Truffle-1 hardware thread on the hardware iteration path behind the Truffle AI Computer: SLA resin shells, thermal constraints, SLS printing, nitrogen tanks, FDM as a rapid sketch tool, and the hall of misfit shells that led to the final material direction.

Thread posts:

  1. https://x.com/jvboid/status/1869450137703264522?s=20
  2. https://x.com/jvboid/status/1869450140807024671?s=20
  3. https://x.com/jvboid/status/1869450144250486824?s=20
  4. https://x.com/jvboid/status/1869450147895390305?s=20
  5. https://x.com/jvboid/status/1869450151523197141?s=20
  6. https://x.com/jvboid/status/1869450154551738687?s=20
  7. https://x.com/jvboid/status/1869450158301450726?s=20